silicone rubber products

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phase change material k=3.4

Negotiated

Phase Change Material K=3. 4
Features High performance Low thermal impedance Can b
post: Oscar@glpoly

printable phase change material k=3.4

Negotiated

Printable Phase Change Material K=3. 4
Features High performance Low thermal impedance Can b
post: Oscar@glpoly

phase change material k=2.5

Negotiated

Phase Change Material K=2. 5
Features High performance Low thermal impedance Can b
post: Oscar@glpoly

phase change material k=3.5

Negotiated

Phase Change Material K=3. 5
Features High performance Low thermal impedance Can b
post: Oscar@glpoly

phase change material k=1.6

Negotiated

Phase Change Material K=1. 6
Features High performance Low thermal impedance Can b
post: Oscar@glpoly

thermal gel k=1.5

Negotiated

Thermal Gel K=1. 5
Features High thermal performance Low thermal resistance
post: Oscar@glpoly

thermal gel k=2.0

Negotiated

Thermal gel k=2. 0
Features High thermal performance Low thermal resistance
post: Oscar@glpoly

thermal gel k=4.0

Negotiated

Thermal Gel K=4. 0
Features Thermal conductivity 4.0W/mK Low thermal resist
post: Oscar@glpoly

thermal gel k=5.0

Negotiated

Thermal Gel K=5. 0
Features Thermal conductivity 5.0W/mK Low thermal resist
post: Oscar@glpoly

thermal gel k=6.0

Negotiated

Thermal Gel K=6. 0
Features Thermal conductivity 6.0W/mK Low thermal impeda
post: Oscar@glpoly

thermal gel k=8.0

Negotiated

Thermal Gel K=8. 0
Features Thermal conductivity 8.0W/mK Wet out surface, n
post: Oscar@glpoly

thermal gel k=3.2

Negotiated

Thermal Gel K=3. 2
Features High thermal performance Low thermal resistance
post: Oscar@glpoly

non-silicone thermal gel k=1.5

Negotiated

Non-silicone thermal gel K=1. 5
Features High thermal performance Low thermal resistance
post: Oscar@glpoly

non-silicone thermal putty k=2.0

Negotiated

Non-silicone thermal putty K=2. 0
Features High thermal performance Low thermal resistance
post: Oscar@glpoly

non-silicone thermal gel k=3.0

Negotiated

Non-silicone Thermal Gel K=3. 0
Features High thermal performance Low thermal resistance
post: Oscar@glpoly

thermal gel k=3.2

Negotiated

Thermal Gel K=3. 2
Features High thermal performance Low thermal resistance
post: Oscar@glpoly

thermally conductive stuctural adhesive k=3.0

Negotiated

Thermally Conductive Stuctural Adhesive K=3. 0
Features Thermal conductivity 3.0W/(m.K), flammability UL 9
post: Oscar@glpoly

thermally conductive stuctural adhesive k=1.2

Negotiated

Thermally Conductive Stuctural Adhesive K=1. 2
Features Filling gaps between heat source and heat sink
post: Oscar@glpoly

thermally conductive structural adhesive k=2.0

Negotiated

Thermally Conductive Structural Adhesive K=2. 0
Features Thermal conductivity 2.0 W/(m.K), low stress Ex
post: Oscar@glpoly

thermal gap filler k=1.5

Negotiated

Thermal Gap Filler K=1. 5
Features Thermal conductivity 1.5W/mK Conforming, ideal
post: Oscar@glpoly